Also... Doing a 'Direct Commit' to see if that is 'acceptable' for small changes like this. I want to look at the commit history and see how the logs handle this type of change.
* Fix thermal protection documentation.
Even before the recent thermal protection changes, the documentation of
the thermal protection feature in the config files did not match the
implementation. I fixed the documentation and reconciled the M303
implementation with the documentation.
* Applied documentation changes to sample config files
* Renamed hysteresis to watch_temp_increase
* Added gcodes back into documentation.
* Fix G26's circle drawing...
This mostly catches the bugfix-v1.1.x branch up to bugfix-v2.0.0
I'll have to do something similar to get bugfix-v2.0.0 caught up to
bugfix-v1.1.x
* only use planner.leveling_active if appropriate
Initial conflict resolution of SD_REPRINT_LAST_SELECTED_FILE (#8104)
* Initial conflict resolution
All previous items resolved:
- Use of ELAPSED() on timer code
- Switch to use of defer_return_to_status=true as much as possible
- Update & Clean Up of Max7219 routines
* Resolve non-SD case in ultralcd.cpp
Changes to support NEOPIXEL LED strips
- Support for different NEOPIXEL as defined in Adafruit_NeoPixel.h
- ability to setup startup brightness
- ability to define sequential/non-sequential transition of color change during heating-up
- additional parameter to M150 P<brightness>
Ideally, it should be calculated based on Z steps per unit so that each
babystep corresponds to around 0.025mm. Smaller than this is largely
insignificant for typical layer heights.